Titanium anode for PCB (Printed Circuit Board) horizontal copper plating refers to a titanium electrode used in the process of horizontally electroplating copper on printed circuit boards.
Titanium is often selected as the anode material due to its good corrosion resistance and electrical conductivity. In the copper plating process, the titanium anode plays an important role in providing the necessary electrical current and facilitating the deposition of copper ions onto the PCB surface to form a copper plating layer.
The use of titanium anodes helps ensure the uniformity and quality of the copper plating, and is an important component in the PCB manufacturing process.
How does titanium anode for PCB horizontal copper plating work?
The working principle of the titanium anode for PCB horizontal copper plating is as follows:
When an electric current is passed through the plating bath, the titanium anode acts as the positive electrode. At the anode, oxidation reactions occur. Water molecules may be oxidized to generate oxygen gas. The titanium anode provides a conductive path for the current and maintains the electrical field in the plating bath.
Meanwhile, copper ions in the plating solution are attracted to the cathode (the PCB surface to be plated) and are reduced and deposited there, gradually forming a copper plating layer. The titanium anode helps to maintain the stability and uniformity of the plating process by ensuring a proper supply of ions and electric field distribution.
